Vacuum Brazing High Density Copper Skived Fin Microchannel CPU Liquid Cold Plate Heat Sink
Lori high density skived fin cold plate is designed for liquid cooling systems. The skiving fin process optimizes the microchannel design of the cold plate surface, increasing the contact area between the fluid and the cold plate, ensuring uniform fluid distribution and avoiding localized overheating problems. The copper skived microchannel liquid cold plate has high fluid cooling efficiency and excellent heat transfer properties, enabling rapid absorption of heat from the heat source and dissipate it.The microchannel CPU liquid cold plate heat sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
The skived fin heat sink has a high ,high density, ultra-thin fin and ultra-small spacing characteristic, which can increase the heat dissipation area per unit volume and improve the heat dissipation performance of the product.
2.Stable Thermal Conductivity
Compared with the skived fin heat sink, it has a one-time molding, stable thermal conductivity, no loss caused by the process and no risk of loosening and falling off, and the processing ability is increased in the later period, and the heat dissipation performance can be improved with buried copper pipes and other processes.
3.Higher Adaptability
It can meet the design requirements of large/ultra-small size high-power heat sink, and make up for the shortcomings of aluminum extrusion heat sink or extrusion heat sink structure.
4.System Stability
It can replace profile heat sinks, skived fin heat sinks, folding FIN heat sinks, die casting heat sinks, forging heat sinks.
5.Diversification of Structural Types
Can do single side skived fins, can also do double side skived fins, pipe four sides skived fins, skived ring fins, particular shaped fins, etc.
| Specification | Customizable Dimensions; Standard Profiles Available |
| Material | High-Purity Copper (C11000 / C10200) | Excellent Thermal Conductivity |
| Craft Technology |
Precision Skiving / Fins Cutting | One-Piece Forming |
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Fin Density: High-Density Customization | Ultra-Thin Fin Design |
| Thermal Performance | Thermal Conductivity: > 400 W/m·K | Optimized Fin Structure for Max Heat Dissipation |
| Surface Treatment | Nickel Plating / Tin Plating | Anti-Oxidation & Corrosion Resistant |
| Machining Options |
CNC Drilling, Tapping, Milling | Threaded Inserts & Mounting Flanges Available |
| Application Scope | High-Power LED, Industrial Inverters, New Energy Vehicles, Medical Equipment, Server Thermal Management |
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Ideal for High-Heat Density Environments | Reliable Long-Term Operation |