High-Density Copper Heatsink Solution for Cloud Server Manufacturer

We delivered a batch of high-precision copper skiving heatsinks for a leading cloud computing server provider, designed for high-power CPU and GPU chips in data centers. The one-piece forming process realized ultra-thin fins (0.2mm thickness) and high fin density, increasing the heat dissipation area by 40% compared with traditional extrusion heatsinks. The product achieved a thermal conductivity of over 400W/m·K, effectively reducing the chip operating temperature by 8-10℃, supporting the client's 1U high-density server deployment and improving the energy efficiency ratio of the data center.